TC600 2-Layer 30mil ENEPIG PCB for Thermal Management Applications
1.Introduction of TC600 laminates
Rogers TC600 laminates are composites of PTFE, thermally conductive ceramic fillers and woven glass reinforcement, which is designed to provide enhanced heat-transfer through "Best-In-Class" thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies. The best-in-class thermal conductivity and mechanical robustness enable printed circuit board (PCB) size reduction. The increased thermal conductivity provides higher power handling, reduces hot-spots and improves device reliability.
2.Key Features
Stable Dielectric Constant: 6.15 at 1.8MHz and 10 GHz/23°C
Low Loss Performance: Dissipation factor of 0.0017 and 0.0020 at 1.8 and 10 GHz/23°C respectively
Superior Thermal Management: High thermal conductivity of 1.1W/mK
Temperature Stability: Stable Dk across wide temperature range of -75ppm/°C from -40°C to 140°C
Excellent Dimensional Stability: Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C)
Environmental Resistance: Low Moisture Absorption 0.03%
3.Benefits
Circuit Miniaturization: High dielectric constant for circuit size reduction
High Frequency Performance: Low loss, ideal for operating at X-band or below
Enhanced Reliability: Low Z-axis expansion, providing reliable plated through holes in multilayer boards
Environmental Stability: Low moisture absorption, reducing effects of moisture on electrical loss
Consistent Performance: Tight Dk and thickness control for repeatable circuit performance
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | TC600 |
| Layer Count | Double sided |
| Board Dimensions | 112mm × 60mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.8mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENEPIG |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (12-Layer Rigid Structure)
Copper Layer Top - 18 μm + 17μm plating
TC600 Core - 0.762 mm (30mil)
Copper Layer Bottom - 18 μm + 17μm plating
6.PCB Statistics:
Components: 32
Total Pads: 146
Thru Hole Pads: 94
Top SMT Pads: 52
Bottom SMT Pads: 0
Vias: 77
Nets: 2
7.Typical Applications
Power Amplifiers, Filters and Couplers
Microwave Combiner and Power Divider Boards in Avionics Applications
Small Footprint Antennas
Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
GPS & Hand-held RFID Reader Antennas
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
